3D solder paste inspection machine (SPI)
3D board visual inspection machine (AOI)
RV-2-3DH(AOI/SPI)
Overwhelming speed
Remarkable accuracy
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Features
- Overwhelming speed
Large improvement in inspection tact with high-pixel (12 million pixels)
- Remarkable accuracy
Using high-resolution lenses improves inspection accuracy of ultra-compact components
- Ease of use of rating
Process modes that are easy to use and create,from beginners to senior citizens
- Visual inspection automation
RV series, which can also be used for measurement
- For improving the efficiency of the entire plant
Achieving the efficiency of the entire factory through system linkage
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Specification
Board size |
50mm×50mm-410mm×300mm
50mm×50mm-630mm×300mm (action to long board)*1 |
Test resolution |
12μm (standard resolution)/5μm (high resolution)*1 |
Image angle |
48.0×36.0mm、20.0×15.0mm*1 |
Inspection items |
Shorting, shear, polarity, side-reverse, unsoldered solder, bridge, solder quantity, insertion part omission, character recognition*1 |
FOV
(Optimum condition) |
2D |
0.2sec/1 screen |
3D |
61.8cm²/sec |
*1 This can be done with the optional.
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