With unique „Fast Remove“ Pumpsystem

With unique „Fast Remove“ Pumpsystem

• Display easy to operate

• Timer-Function

• Pump and Solder bath made of full Titanium best for lead free alloys

• On the fly – Wave hight regulation

• Standby-Function to reduce process time

• Wide range of standard solder nozzles and customized nozzles

• Huge top space for very large boards

• Optional Laserpointer und XY – Table

• Optional Nitrogen Inert to reduce dross

• Magnetic PCB-fixtures in different sizes, 

  for free positioning

• Wide range of standard solder nozzles and customized nozzle

The solder pump system

The unique flat pump design with a superb „ Fast Remove” system allows maintenance within minutes. Just an easy turn with the supplied tooling gives instant access to the pump and solder bath.

Technical Data

Power: 220 V (50/60 Hz) / 2 KW
Temperature: 0 – 400 °C
Solder Capacity: ca. 20 kg
PCB size: no Limits
Measurements: 400 (B) x 700 (L) x 250 (H) mm
Weight: ca. 35 kg with empty solder pot

BROCHURE (PDF)