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Products

High-Speed Flexible Mounter KE-3020VA

Higher Speed, Higher Quality, Improved Capacity.

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Features

Continued Evolution of the KE Series

 
Chip 20,900CPH chip (Laser centering / Optimum)
17,100CPH chip (Laser centering / IPC9850)
IC 9,470CPH (Vision centering / MNVC)

Specification

Board size M size (330×250mm) yes
L size (410×360mm) yes
L-Wide size (510×360mm) *1 yes
XL size (610×560mm) yes
Applicability to long PWB (L size)*2 800×360mm
Applicability to long PWB (L-Wide size)*2 1,010×360mm
Applicability to long PWB (XL size)*2 1,210×560mm
Component height 12mm yes
20mm yes
25mm(XL size) yes
Component size Laser recognition 0402(01005) ~ 33.5mm×33.5mm
Vision recognition Standard camera 3mm ~ 74mm×74mm or 50×150mm
High-resolution camera 1.0×0.5mm*3 ~ 48mm×48mm or 24×72mm
Placement speed Chip Optimum 20,900CPH
IPC9850 17,100CPH
IC *4 9,470CPH*5
Placement accuracy Laser recognition ±0.05 mm (±3σ)
Vision recognition ±0.03mm(MNVC ±0.04mm)
Feeder inputs Max.160 in case of 8mm tape
(on a Electric double tape feeder)*6


*1 L-Wide size is optional
*2 Applicability to long PWB is optional.
*3 KE-3020VA : When using high-resolution camera. (option)
*4 Effective tact : The IC placement speed indicates an estimated value obtained when the machine places 36 QFP (100 pins or more) or BGA components (256 balls or more) on a M size board. (CPH=number of components placed for one hour)
*5 Estimated value when using MNVC and picking up components simultaneous with all nozzles.
.MNVC is standard in the KE-3020VA.
*6 When using Electric double tape feeder EF08HD.
* PWB size XL will be KE-3020V.

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