3D solder paste inspection machine (SPI)
3D board visual inspection machine (AOI)
RV-2-3DHL（AOI/SPI）
Overwhelming speed
Remarkable accuracy
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Features
- Overwhelming speed
Large improvement in inspection tact with high-pixel (12 million pixels)
- Remarkable accuracy
Using high-resolution lenses improves inspection accuracy of ultracompact components
- Ease of use of rating
Process modes that are easy to use and create,from beginners to senior citizens
- Visual inspection automation
RV series, which can also be used for measurement
- For improving the efficiency of the entire plant
Achieving the efficiency of the entire factory through system linkage
Specification
| Board size |
Standard: 50mm×50mm-410mm×590mm
Long board: 50mm×50mm-650mm×590mm*1
Marking unit: 50mm×50mm-330mm×590mm |
| Test resolution |
12 μm (standard resolution) / 5 μm (high resolution)*1 |
| Image angle |
48.0×36.0mm, 20.0×15.0mm*1 |
| Inspection items |
Shorting, shear, polarity, side-reverse, unsoldered solder, bridge, solder quantity, insertion part omission, character recognition*1 |
Inspection speed
(Optimum condition) |
| 3D |
61.8cm²/sec |
*1 This can be done with the optional.
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